High heat-resistant epoxy resin liquid material 'VX-3657A/B'
Adapted for high heat resistance! We provide liquid formulation materials used in power modules and more.
"VX-3657A/B" is a liquid epoxy resin formulation designed to meet the high heat resistance requirements associated with the advancement and miniaturization of electronic products. Due to its characteristics of high heat resistance, high fluidity, and low stress, it is applicable in power modules and similar applications. Additionally, because of its low linear expansion and low shrinkage rate, it is also used for high heat-resistant substrate encapsulation. 【Physical Property Data (Partial)】 ■ Curing Conditions ・100℃×1h + 180℃×2h ■ Glass Transition Temperature ・200℃ ■ Linear Expansion Coefficient α1 ・14ppm *For more details, please refer to the PDF document or feel free to contact us.
- Company：日本合成化工
- Price：Other
